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Traditional LED packaging cost pressure highlights,COB light source or into the mainstream
2011/12/14
10:11 am
ledlighting90
Member
Forum Posts: 20
Member Since:
2011/10/27
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COB light source was popular at that time, its superior performance and low cost manufacturing heat is affected by many

packaging enterprise chase after hold in both hands,However, when you have nothing to this stent packaging technology, its

efficacy, life reliability problems but could not be guaranteed, and soon, COB encapsulation and be quiet..

At present, the LED encapsulation of link cost is higher, LED the overall cost of reducing device, in addition to materials,

but also need to choose a low cost efficient encapsulation structure,Therefore, how to change the existing encapsulation

structure and realizing reasonable low packaging costs, become the industry improve market penetration of LED lighting is the

most effective and most direct route,COB light production relatively low cost, cooling function obvious, and high packing

density and higher than the optical density characteristics, and its can be encapsulated mainstream has been the focus of

focuses on the industry.

According to investigation, at present COB light source and the market gradually "back to the temperature" and part of the COB

lighting manufacturers and releasing the new related products.

Technology breakthrough,Back to the temperature gradually COB light source
 
"Compared with the traditional LED packaging technology, COB panel light source the light was soft, have very big market, the
 
future is a development trend of", the science and technology, the chairman WangRuiXun said.
 
According to the survey, on the market at present the enterprise number do COB encapsulated in increases gradually, part of
 
the enterprise already can achieve mass production.From last year, the Japanese manufacturers COB light source technology has
 
improved,Many firms have started to turn to COB packaging mode, COB substrate materials also have improved, or early copper
 
substrate, development to aluminum plate, and then to at present partial enterprise the ceramic substrates, and gradually
 
improve the reliability of the COB light source.
 
In march this year, the Japanese xi tiecheng breathes out what introduce a more chips type products to COB technology, will be
 
a number of blue LED chips in receive package and achieve high performance of radiator, COB technology to market will again,
 
In addition, another giant of sharp Japan ceramic plate has also realize the COB production, it is Asia a few energy
 
production ceramic is one of the enterprises in COB light source,In domestic, although COB light source of development
 
experience a round of pain, but there are many enterprises to continue research and development, and obtained a certain
 
technology achievements.Package the listed company optoelec chairman LiGuoPing said, "now has the photoelectric use ceramic
 
substrate, aluminum plate and so on many kinds of materials research COB light source, and had already realize mass
 
production, efficacy also got bigger ascension, product reliability is good.
 
"Ceramic substrates can well solve the reliability of the COB, but the relatively high cost of materials, and has a certain
 
technical difficulty", WangRuiXun said. According to a senior LED reporter understanding, the current domestic energy
 
production ceramic COB light enterprise number increases, and the application is also gradually expanded.
 
One day the photoelectric ceramic COB encapsulation already energy production, shenzhen crystal blue from last year's from the
 
traditional aluminum plate also gradually to use ceramic, last year only light source 20 million sales COB yuan. In addition
 
to the blue TianWeiGuang, such as domestic GuangBao a batch of enterprise also has its extended to COB light source.
 
"The COB encapsulates the ball steep light have dominated the LED light bulb around 40% of the market, Japan and many domestic
 
enterprises are starting to go COB packaging mode, it is the future trend of", fujian nations optoelectronic technology Co.,
 
LTD. The chairman HeWenMing emphasis.
 
In addition, COB light source is not only the material and its reliability have improved, the optical technology also got
 
further promoted. COB though has good heat source functions, but under the base board of copper foil, only good electricity,
 
but can't do very good optical processing, therefore we have put forward enterprise MCOB technology. MCOB out light than to
 
the high efficiency COB light source, is expected to become the mainstream market.
 
Cost reduction COB encapsulation advantage prominent
 
In recent years, high power LED packaging requirements gradually to the thin and low cost changed, and the light source with
 
the COB low cost, application convenience and design and diversification advantage for market value.
 
According to the engineers LED industry research institute research report, 2010 Japan LED light bulb market fast expansion
 
become the LED lighting of the typical example.At present Japan's LED ball steep light market mainly to COB in polycrystalline
 
encapsulation is given priority to, the traditional high power chips and module is mostly used as MR16 directionality LED
 
light source, etc."And the traditional LED SMD/type encapsulation and high power packaging, packaging can be compared COB more
 
than one chip directly sealed in the metal matrix printed circuit board MCPCB, through the base board direct heat dissipation,
 
could not only reduce the manufacturing process and support costs, but also has reduced thermal resistance of cooling
 
advantage", nantong kai reputation of President of limited company of lighting technology XieJian said. In addition to reduce
 
the use of the stents, COB and at the same time omit some technology, and maintain product quality unchanged.
 
XieJian further points out, "there are enterprise directly in the canister light light cup as a heat sink, need not add the
 
radiator, SMD packaging in the patch, need reflow soldering, their high temperature on chip harm. However COB encapsulation
 
don't need reflow soldering, therefore, also do not need to buy placement machine and welding equipment, not only reduces the
 
application enterprise to the threshold of the house, at the same time also reduced the cost."
 
COB encapsulates the cost savings is multifaceted. With 25 W LED as an example, the traditional 25 W high power LED light
 
source, should be used in 25 of the 1 W LED chip packages into 25 a LED components, and COB polymorphism is a 1 W will be 25
 
LED chip packages in a single chip, so need two optical lens will 25 pieces from reduced to 1 piece, help to narrow the light
 
source area, reduction material, system cost, then it can be simplified light source is second optical design and save
 
assembly manpower cost.
 
Reliability scores can become a mainstream COB package?
 
At present the enterprise to COB integrated packaging application needs little, due to a failure in many lighting applications
 
enterprise can't use this package. "COB light source in addition to heat dissipation good performance, cost low cost, also can
 
personalized design, is the future development direction of the leading one of the packages", shenzhen crystal blue's deputy
 
general manager TangLiangFa said.
 
At present, however, the energy market in the packaging enterprise little COB light source, and mostly used aluminum plate as
 
materials. "The bottleneck of COB packaging technology is how to enhance the reliability of the light source, and its
 
environment trial degree", LiGuoPing said. On the market is used more aluminum plate COB, because its thermal resistance is
 
bigger, reliability is not high, prone to failure and death light lamp phenomenon.
 
 
However, ceramic matrix although is one of the ideal material COB, but the cost is high, in less than 2 W power when cost is
 
higher, but difficult to be accepted."The market is still in a light source for COB on the fence, demand is not high. The
 
little chips used more, big chip packages still exist thermal resistance COB and efficacy, and many other problem", a
 
Taiwanese packaging technology engineer said. Because in a lower COB optical lens caused by the refraction of many times the
 
light loss, so in the light and heat energy efficiency increase to improve still, substrate production yield to ascend.
 
"The COB light source still exist, packaging manufacturer and standardized problem of lighting products factory standard, so
 
it couldn't connection also caused the market demand to COB little light source the embarrassing situation," has worked for
 
many years at the sharpness of a technical engineers told reporters, in order to strengthen the market demand, many
 
enterprises implement the COB encapsulation and application integration, solve the problem of product standards not
 
consistent.According to information, mainly depends on the COB light source eutectic technology, in support of materials and
 
flip chip technology, but at present, including Taiwan manufacturer, can make the high reliability of the light source COB
 
enterprise rare.
 
LED module into COB light sources and vertical light source and so on many kinds of structure form, sharp, osram, philips,
 
such as the international leaders go vertical light module road, and in the white light has RGB was a breakthrough.
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